The device can replace the manual machine, and provide an equipment of varies die bonder.

该装置可取代手动装置, 为各种粘片机提供配套设备.

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This product design for IC assembly die bonding process on die bonder machine.

本产品是为IC封装自动贴片机及其贴片工艺而设计.

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The auto Die Bonder for SOT - 23 transistor is a high - speed , high - precision, machinery electronics integrated equipment.

SOT-23晶体管封装自动键合机是 高速 、 高精度机电一体化精密设备.

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This product design for IC assembly die attache process on die bonder machine.

本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计.

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Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

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