In summary, dry film photo - resist was applied to the wafer level high frequency flip - chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

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Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level.

静电键合是片状材料封接的一种重要手段,讨论了玻璃在电场作用下的键合过程.

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This paper discusses a true wafer level packaging ( WLP ) technology which is called Ultra CSPTM.

文章论述了超CSPTM圆片级封装技术工艺.

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The BIR manufacturing framework consists of two major systems : wafer - level reliability ( WLR ) and the BIR database.

对半导体制造业来说,内建可靠性方法由两大部分组成: 圆片级可靠性系统和内建可靠性数据库.

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