Underfill technology effectively enhances the flip - chip cycle fatigue life and reliability of packaging process.
有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.
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The die cracking with no - flow underfill is analyzed case for conventional capillary - flow underfill.
用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题.
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