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Based on the old non - bright tin electroplating, the sealing process was added.
在原有的雾面锡电镀工艺基础上, 增加了封闭工序.
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Whisker problem must be firstly solved in developing a lead - free pure tin electroplating process.
开发无铅化纯锡电镀技术必须首先解决锡须问题.
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