Iron - nickel - phosphorus - boron quaternary alloy electroless plating on copper panel was described.

在铜基上化学镀铁 - 镍 - 磷 - 硼四元合金.

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The electronic structure of a quaternary alloy has been investigated using EHT band calculation method.

用紧束缚能带计算方法(EHT)研究了标题多元合金的能带及电子结构.

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Formula of iron - nickel - phosphorus - boron quaternary alloy electroless plating was optimized so as to obtain amorphous deposit.

并筛选出获得铁 - 镍 - 磷 - 硼四元非晶态镀层的最佳配方.

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