In summary, dry film photo - resist was applied to the wafer level high frequency flip - chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

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The purpose of this thesis is to apply dry film photo - resist for high frequency flip - chip packaging .

本论文研究的方向是将乾膜 光阻 应用于高频 覆晶封装 上.

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Electroformed apertures reproduce the mandrel photo resist finish faithfully and do not require any further processing.

电铸复制卷筒照片孔型图,不需要进一步的加工.

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