This paper introduces the application state of the bonding technology to the bus outer panel.

介绍蒙皮粘接技术在大客车上的应用.

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Micro adhesive bonding technology shows great potential in the assembly of micro - electro mechanical system ( MEMS ) products.

微胶接技术非常适用于微机 电系统 产品的自动化装配过程.

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The applications of cryogenic adhesive bonding technology in SQUID non - magnetic Dewar and other fields are introduced.

介绍了低温粘接技术在SQUID无磁杜瓦及其它领域中的应用.

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Components qualities of bonding technology are influenced by many factors, which are complicated.

胶接工艺中构件质量受多种因素的影响, 内容比较复杂.

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The application of wafer bonding technology in long ? wave vertical cavity devices is given.

最后介绍了晶片键合技术在长波长垂直腔型器件研制中的应用.

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